Single EP
Wafer holder with front side contacts.
Electroplating has been applied to a variety of micromachining applications from solder bumps for flip-chip assemblies to freely moving structures made in gold or nickel. AMMT has introduced a product line of wafer holders adapted to the needs of the electroplating engineer. Different from holders for electrochemical etch-stop applications with electrical backside contacts, electroplating requires a contact at the front or plating side, which is in contact with the electrolyte solution.
To provide the plating current, AMMT's electroplating holders have a circular stainless-steel ring embedded around the edge zone of the wafer. This zone is kept dry by a set of electrolyte-compatible O-ring seals. Electrical contact to the wafer is achieved by four or more spring-loaded gold contact pins.
Electroplating holders are available 4", 5" or 6" and 8" wafers. Please contact us for further information.
Wafer holder with front side contacts.
To provide the plating current, AMMT's electroplating holders have a circular stainless-steel ring embedded around the edge zone of the wafer. This zone is kept dry by a set of electrolyte-compatible O-ring seals. Electrical contact to the wafer is achieved by four or more spring-loaded gold contact pins.
Electroplating holders are available 4", 5" or 6" and 8" wafers. Please contact us for further information.
Images. Click to enlarge.
For more information, please download our product info below.
For a complete list of our product information sheets please see our Documentation Download Section.
For a complete list of our product information sheets please see our Documentation Download Section.